? semiconductor components industries, llc, 2016 june, 2016 ? rev. 5 1 publication order number: nlx1g11/d nlx1g11 3-input and gate the nlx1g11 is an advanced high?speed 3?input cmos and gate in ultra?small footprint. the nlx1g11 input structures provide protection when voltages up to 7.0 v are applied, regardless of the supply voltage. features ? high speed: t pd = 2.4 ns (typ) @ v cc = 5.0 v ? designed for 1.65 v to 5.5 v v cc operation ? low power dissipation: i cc = 1 a (max) at t a = 25 c ? 24 ma balanced output source and sink capability ? balanced propagation delays ? overvoltage tolerant (ovt) input pins ? ultra?small packages ? nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these are pb?free devices c b a y gnd 1 2 3 5 4 c y & figure 1. pinout (top view) figure 2. logic symbol 6 v cc b a pin assignment 1 2 3b a gnd 4 5v cc y function table l x x h input x l x h 6c pin function ab x x l h output l l l h cy h ? high logic level l ? low logic level x = either low or high logic level www. onsemi.com see detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ordering information marking diagrams x = device marking m = date code = pb?free package udfn6 1.2 x 1.0 case 517aa udfn6 1.45 x 1.0 case 517aq udfn6 1.0 x 1.0 case 517bx 1 x m 1 m 1 m e p
nlx1g11 www. onsemi.com 2 maximum ratings symbol parameter value unit v cc dc supply voltage ?0.5 to +7.0 v v in dc input voltage ?0.5 to +7.0 v v out dc output voltage ?0.5 to +7.0 v i ik dc input diode current v in < gnd ?50 ma i ok dc output diode current v out < gnd ?50 ma i o dc output source/sink current 50 ma i cc dc supply current per supply pin 100 ma i gnd dc ground current per ground pin 100 ma t stg storage temperature range ?65 to +150 c t l lead temperature, 1 mm from case for 10 seconds 260 c t j junction temperature under bias 150 c ja thermal resistance (note 1) 496 c/w p d power dissipation in still air @ 85 c 252 mw msl moisture sensitivity level 1 f r flammability rating oxygen index: 28 to 34 ul 94 v?0 @ 0.125 in v esd esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4) >2000 >200 n/a v i latchup latchup performance above v cc and below gnd at 125 c (note 5) 500 ma stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. measured with minimum pad spacing on an fr4 board, using 10 mm?by?1 inch, 2 ounce copper trace no air flow. 2. tested to eia/jesd22?a114?a. 3. tested to eia/jesd22?a115?a. 4. tested to jesd22?c101?a. 5. tested to eia / jesd78. recommended operating conditions symbol parameter min max unit v cc positive dc supply voltage operating data retention only 1.65 1.5 5.5 5.5 v v in digital input voltage (note 6) 0 5.5 v v out output voltage 0 5.5 v t a operating free?air temperature ?55 +125 c t/ v input transition rise or fall rate v cc = 1.8 v 0.15 v v cc = 2.5 v 0.2 v v cc = 3.3 v 0.3 v v cc = 5.0 v 0.5 v 0 0 0 0 20 20 10 5 ns/v functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. 6. unused inputs may not be left open. all inputs must be tied to a high or low?logic input voltage level.
nlx1g11 www. onsemi.com 3 dc electrical characteristics symbol parameter conditions v cc (v) t a = 25 c t a = ?55 c to +125 c unit min typ max min max v ih low?level input voltage 1.65 0.75 x v cc 0.75 x v cc v 2.3 to 5.5 0.70 x v cc 0.70 x v cc v il low?level input voltage 1.65 0.25 x v cc 0.25 x v cc v 2.3 ? 5.5 0.30 x v cc 0.30 x v cc v oh high? level output voltage v in = v ih or v il i oh = ?100 a 1.65 ? 5.5 v cc ?0.1 v cc v cc ?0.1 v v in = v ih or v il i oh = ?4 ma i oh = ?8 ma i oh = ?12 ma i oh = ?16 ma i oh = ?24 ma i oh = ?32 ma 1.65 2.3 2.7 3.0 3.0 4.5 1.29 1.9 2.2 2.4 2.3 3.8 1.52 2.15 2.4 2.8 2.68 4.2 1.29 1.9 2.2 2.4 2.3 3.8 v ol low?level output voltage v in = v ih or v il i ol = 100 a 1.65 ? 5.5 0.1 0.1 v v in = v ih or v il i oh = 4 ma i oh = 8 ma i oh = 12 ma i oh = 16 ma i oh = 24 ma i oh = 32 ma 1.65 2.3 2.7 3.0 3.0 4.5 0.08 0.1 0.12 0.15 0.22 0.22 0.24 0.3 0.4 0.4 0.55 0.55 0.24 0.3 0.4 0.4 0.55 0.55 i in input leakage current 0 v in 5.5v 0 to 5.5 0.1 1.0 a i off power?off output leakage current v in or v out = 5.5 v 0 1.0 10 a i cc quiescent supply current 0 v in v cc 5.5 1.0 10 a product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. ac electrical characteristics (input t r = t f = 2.5 ns) symbol parameter v cc (v) test condition t a = 25 c t a = ?55 c to +125 c unit min typ max min max t plh , t phl propagation delay, input to output 1.65?1.95 r l = 1 m , c l = 15 pf 2.0 5.5 18.5 2.0 19 ns 2.3?2.7 r l = 1 m , c l = 15 pf 0.8 3.0 11 0.8 11.5 3.0?3.6 r l = 1 m , c l = 15 pf 0.5 2.6 7.5 0.5 8.0 r l = 500 , c l = 50 pf 1.5 3.0 8.5 1.5 9.0 4.5?5.5 r l = 1 m , c l = 15 pf 0.5 2.2 5.5 0.5 6.0 r l = 500 , c l = 50 pf 0.8 2.4 7.0 0.8 7.5 c in input capacitance 5.5 v in = 0 v or v cc 4.0 pf c pd power dissipation capacitance (note 7) 3.3 5.5 10 mhz v in = 0 v or v cc 20 26 pf 7. c pd is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumpt ion without load. average operating current can be obtained by the equation i cc(opr) = c pd ? v cc ? f in + i cc . c pd is used to determine the no?load dynamic power consumption: p d = c pd ? v cc 2 ? f in + i cc ? v cc.
nlx1g11 www. onsemi.com 4 v cc gnd 50% 50% v cc a and b y t phl t plh figure 3. switching waveforms figure 4. test circuit input output r l c l a 1 mhz square input wave is recommended for propagation delay tests t r = t f = 2.5 ns, 10% to 90%, f = 1 mhz, t w = 500 ns ordering information device package shipping ? nlx1g11mutcg (in development) udfn6, 1.2 x 1.0, 0.4p (pb?free) 3000 / tape & reel nlx1g11amutcg udfn6, 1.45 x 1.0, 0.5p (pb?free) 3000 / tape & reel NLVX1G11AMUTCG* udfn6, 1.45 x 1.0, 0.5p (pb?free) 3000 / tape & reel nlx1g11cmutcg udfn6, 1.0 x 1.0, 0.35p (pb?free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *nlv prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable.
nlx1g11 www. onsemi.com 5 package dimensions udfn6 1.2x1.0, 0.4p case 517aa issue d notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.25 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 2x 0.10 c pin one reference top view 2x 0.10 c 10x a a1 (a3) 0.08 c 0.10 c c seating plane side view l2 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.127 ref b 0.15 0.25 d 1.20 bsc e 1.00 bsc e 0.40 bsc l 0.30 0.40 l1 0.00 0.15 mounting footprint* dimensions: millimeters 0.22 6x 0.42 6x 1.07 0.40 pitch *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. l1 detail a bottom view (optional) 0.40 0.50
nlx1g11 www. onsemi.com 6 package dimensions udfn6 1.45x1.0, 0.5p case 517aq issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. a b e d bottom view b e 6x 0.10 b 0.05 a c c l 6x note 3 0.10 c pin one reference top view 0.10 c 6x a a1 0.05 c 0.05 c c seating plane side view 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 b 0.20 0.30 d 1.45 bsc e 1.00 bsc e 0.50 bsc l 0.30 0.40 l1 ??? 0.15 dimensions: millimeters 0.30 6x 1.24 0.53 pitch *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.50 1 mounting footprint package outline l1 detail a l optional constructions l 0.07 ref 6x a2 detail b detail a
nlx1g11 www. onsemi.com 7 package dimensions udfn6 1.0x1.0, 0.35p case 517bx issue o soldering footprint* recommended dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.12 0.22 d 1.00 bsc e 1.00 bsc e 0.35 bsc l 0.25 0.35 l1 0.30 0.40 a b e d 0.10 c pin one reference top view 0.10 c a a1 0.05 c 0.05 c c seating plane side view 2x 2x a3 bottom view b e 6x 0.10 b 0.05 a c c l 5x note 3 l1 1 3 4 6 m m dimensions: millimeters 0.22 5x 0.48 6x 1.18 0.53 pitch 0.35 1 pkg outline on semiconductor and are trademarks of semiconductor components industries, llc dba on semiconductor or its subsidiaries i n the united states and/or other countries. on semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . a listing of on semiconductor?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf . on semiconductor reserves the right to make changes without further notice to any products herein. on semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does o n semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. buyer is responsible for its products and applications using on semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by on semiconductor. ?typical? parameters which may be provided in on semiconductor data sheets and/or specifications can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including ?typic als? must be validated for each customer application by customer?s technical experts. on semiconductor does not convey any license under its patent rights nor the right s of others. on semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any fda class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. should buyer purchase or use on semicondu ctor products for any such unintended or unauthorized application, buyer shall indemnify and hold on semiconductor and its officers, employees, subsidiaries, affiliates, and distrib utors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that on semiconductor was negligent regarding the design or manufacture of the part. on semiconductor is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 nlx1g11/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
|
